Journal+-+Week+2++Febuary+18+2011

Monday Feb. 14. 11: We learned about complex series and parallel circuits, combination circuits and how to solve for the total resistance. Draw both of them and then write the equation and solve for R. And to Simplify. The equation for Parrnell circuit for resistance is shown below. To add for the total resistance is to add all the resistance's together. The equation for series circuit and to solve for resistance is shown below To find the total resistance for a parallel circuit is 1 divided by one over R1 plus 1 over R2 plus one over R2 and so on to get the total resistance of the circuit.

Tuesday Feb. 15. 11: Today we learned about capacitors what they contribute to electronics. WE also learned about how they work and how they store energy for later use of electronics. Capacitors are used in electronic circuits for blocking direct current while allowing ac to pass. Used in many circuit boards and all electronics and it is has a big affect on our daily lives, from in our houses to converting from dc to ac in shops and electronic stores. Then learned about how they work within the electronic board. Capacitors are used everyday and that is why we learned about it. We watched a video about how capacitors work and how they store and release the energy. Then we watched multiple videos about how a surplus of electricity can effect a insulator which leads to rapid expansion and an explosion. For the rest of the class, we took the pictures from the tear down and loaded them on the computer for use on Photo shop. Pictures:

Wednesday Feb. 16. 11 Today we learned about circuit boards and what is their function in electronics. Then we review capacitors and how they work on the circuit board. Then we learned about the function and purpose of transistors. Transistors serve a purpose of amplifying charges within the circuit board when needed. The current passes through the transistor, it gets amply-fed and used when needed at a later time. We watched a couple of videos about transistors and capacitors on you tube therefore creating a visual representation of capacitors and transistors and how they work. We also learned that when replacing a compactor, one must use one with the same amount of voltage rating or higher, to add one more detail of the class. Pictures:

Thursday Feb. 17. 11: Today we learned about transistors and how they can be switched on and off to power an LED light on a circuit board or on a breadboard. We watched a couple of videos about transistors and had a visual representation of the transistors and how they turn off and on LED lights on a breadboard. Pictures:

Friday Feb. 18. 11:

Today we worked on our wiki's and had to finish the the whole wiki for the entire week. We had time when the calss started and then time to finish it at the end of class. Then we worked on Photo shop 8.0, pasting and editing and resizing pictures from our computer tear down and if we did not have some pictures from the computer tear down, then we took pictures from the internet. It was a great week and we learned many things that I did not no yet about electronics.


 * __More Information from Previous Week's:__**

Computer Tear Down By: Stefan Graczyk and Devin Hickey __Completed in first week.__ > Remove any peripheral cards that are attached in to PCI, PCI Express or AGP slots. This would include video cards, sound cards, Wireless network cards, LAN cards and other similar peripherals. These cards are physically plugged into slots and are attached perpendicularly to the motherboard. In some cases a small screw must be removed before you can pull out the card. In other cases, there may be a single latch that holds all of the cards in place. Place each card in an anti-static bag. > Remove the RAM memory sticks from the DIMM slots. These slots typically have a plastic latch on each side that must be snapped open before the memory sticks can be pulled out. It usually works better to pull the memory sticks out one side at a time. Place each memory stick in an anti-static bag. > Take another photo of the inside of the computer. Make sure that your pictures clearly show how each hard drive and DVD /CD-ROM drive is connected to the motherboard. > Disconnect the cables from the hard drive(s) and from the DVD drive. Each drive will have two cables. Note carefully, or photograph exactly how they are connected.
 * 1) Shut down the [|computer] and unplug it from the electrical outlet. Just to be on the safe side, let the computer sit unplugged for at least an hour before you begin the disassembly. This will ensure that the electricity in the power supply has fully dissipated. Also unplug any peripherals from the computer, including USB devices and any connected by serial or parallel ports. Remove your shoes and ground yourself electrically. There is a separate EHow article explaining how to do this.
 * 2) Open the case. This works differently on different [|computers]. Some have a latch that opens, allowing the side panel of the case to simply be slid away. On other cases, you must unscrew several screws. The primary goal is to remove the side panel opposite the motherboard. The motherboards is the large rectangular circuit board into which most of the other components are connected.Take several digital photos of the inside of the computer. These will serve as reference for reassembly.
 * 1) Locate the place where each drive is screwed into the chassis of the computer case. Take photos, if you need to, in order to remember where the screws are positioned. Remove the screws and slide out the drives. Be careful not to let the drives fall onto the motherboard, as they are heavy and could damage the circuitry. Put each drive in an anti-static bag.Very carefully remove the heat sync over the central processor. It is usually held on by a pair of clips. Consult the website of the manufacturer of the heat sync if necessary. Put the heat sync in an anti-static bag.
 * 2) Remove the CPU carefully and pack it in bubble wrap and an anti static bag.

> Disconnect the power supply cable from the motherboard. Support the power supply with one hand while carefully unscrewing it from the chassis. Once all the screws are removed, gently lift the power supply away. Do not attempt to disassemble the power supply. > Disconnect the power lines between the case fans and the motherboard. Make sure that there are no other wires or cables connecting the motherboard to any other objects. Unscrew the motherboard from the chassis and lift it away. Pack it in bubble wrap and then in a large anti-static bag. Congratulations. You computer is now completely disassembled.
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 * __Flasher Circuits: -__ __Thursday Feb. 17. 11__**

This is the week that we learned about flasher circuits and how they work. Flasher circuits are normal circuits that use the power that they receive from the power supply to power one or tow LED flasher's. The problem with a flasher circuit is that you don't have any control over the rate of flashes that it gives out. There are many components of a flasher circuit such as, two transistors, two capacitors and four resistors, a flasher LED and some kind of power supply like a battery or and outlet to plug into a wall outlet. There are many uses of flasher circuits like; railroad crossing signal for model railroads**,** Christmas decorations**,** and blinkers to locate items in the dark**,** just to name a few. Shown below is how a flasher circuit works, how it supplies power to the LED flasher, and a picture of a simple LED flasher circuit:

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The two resistors on the base of the PNP set a threshold voltage and when power is applied the capacitor begins charging toward this voltage. When the capacitor voltage is high enough the two transistors begin to conduct. The current flow causes the voltage across the circuit to drop slightly and this drop causes a drop in the threshold voltage. The lower threshold voltage causes even more current and this positive feedback causes the circuit to rapidly turn on. It stays on until the capacitor discharges at which point a reverse process causes the circuit to suddenly switch off. Power transistors may be added for handling higher current loads. ======



__**Bread Boards Wednesday Feb. 16. 11:**__

The day that we learned about breadboards was Wednesday Feb. 16. 11 and breadboards are one of a kind electronic circuit that can be used for temporary electronic experiments with a easy design that anyone can use. They are also used to try out a new electronic idea's. No soldering is required so it is easy to change connections and replace components. Parts will not be damaged so they will be available to re-use afterwords The way it works is by attaching wire links to the places where you want them to go to have a working circuit. The top and bottom rows are linked horizontally all the way across as shown by the red and black lines on the diagram. The power supply is connected to these rows, + at the top and 0V (zero volts) at the bottom. Thus powering the whole circuit and powering the thing that is going to be powered, for example a light. Pictures:





__** Integrated Circuits: Sand to ICs Friday Feb. 18. 11:**__

On this day we learned many things and watched many you tube videos about many things one of them was about integrated circuits and the process of making a computer chip from sand to silicon. We watched a you tube video about it and the process of the making is shown below.

Sand With about 25% (mass) Silicon is -after Oxygen -the second most frequent chemical element in the earth's crust. Sand -especially Quartz -has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing

Melted Silicon

Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono crystal is called an Ingot.

Mono-crystal Silicon Ingot An ingot has been produced from Electronic Grade Silicon. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.9999999%.

Ingot Slicing The Ingot is cut into individual silicon discs called wafers. The thickness of a wafer is about 1mm.

Wafer

**The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel's highly advanced 32nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.**

Applying Photo Resist Fabrication of chips on a wafer consists of hundreds of precisely controlled steps which result in a series of patterned layers of various materials one on top of another. What follows is a sample of the most important steps in this complex process. In this image there's photo resist (blue color) applied, exposed and exposed photo resist is being washed off before the next step (more details later). The remaining photo resist (blue shine on wafer) will protect material that should not

Ion Implantation The wafer is patterned using photolithography (details of how this is done will be described later). The wafer is bombarded with a beam of ions (positively or negatively charged atoms) which embed themselves beneath the surface of the wafer to alter the conductive properties of the silicon in selected locations. The green regions in the image to the right have these implanted alien atoms.

Removing Photo Resist After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implante

Applying Photo Resist – scale: wafer level (~300mm / 12 inch) The liquid (dark color here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. The wafer spins during this step to allow very thin and even application of this photo resist layer.

Exposure– scale: wafer level (~300mm / 12 inch) The photo resist finish is exposed to ultra violet (UV) light. The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button. The photo resist finish that’s exposed to UV light will become soluble. The exposure is done using masks that act like stencils in this process step. When used with UV light, masks create the various circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask’s image. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern. . Etching– scale: transistor level (~50-200nm) The photo resist is protecting the high-k dielectric that should not be etched away. Revealed material will be etched away with chemicals.

Ready Transistor – This transistor is close to being finished. Three holes have been etched into the insulation layer (red color) above the transistor. These three holes will be filled with copper or other material which will make up the connections to other transistors.

Electroplating– scale: transistor level (~50-200nm) The wafers are put into a copper sulphate solution at this stage. The copper ions are deposited onto the transistor thru a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

After Electroplating – scale: transistor level (~50-200nm) On the wafer surface the copper ions settle as a thin layer of copper

Polishing– scale: transistor level (~50-200nm) The excess material is polished off.

Metal Layers –scale: transistor level (six transistors combined ~500nm) Multiple metal layers are created to interconnect (think: wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (e.g. Intel®Core™ i5 Processor ). While computer chips look extremely flat, they may actually have over 30 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.

Wafer Sort Test – scale: die level (~10mm / ~0.5 inch) This fraction of a ready wafer is being put to a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to “the right answer”. Wafer Slicing – scale: wafer level (~300mm / 12 inch) The wafer is cut into pieces (called dies). For the Intel®Core™ i5 processor there’s one wafer of graphics chips and one wafer of CPU chips. The above wafer contains the CPUs. Discarding faulty Dies – scale: wafer level (~300mm / 12 inch) The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging

Individual Die – scale: die level (~10mm / ~0.5 inch) These are individual dies which have been cut out in the previous step (slicing). The dies shown here are dies of an Intel®Core™ i5 Processor

Packaging– scale: package level (~20mm / ~1 inch) The substrate, the dies and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put on to. This will keep the processor cool during operation

Processor– scale: package level (~20mm / ~1 inch) Completed processor (Intel®Core™ i5 Processor in this case). A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps –only the most important ones have been visualized in this picture story -in the world's cleanest environment (a microprocessor fab) to make microprocessors.

Class Testing – scale: package level (~20mm / ~1 inch) During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).

Binning– scale: package level (~20mm / ~1 inch) Based on the test result of class testing processors with the same capabilities are put into the same transporting trays.

Retail Package – scale: package level (~20mm / ~1 inch) The readily manufactured and tested processors (again Intel®Core™ i5 Processor is shown here) either go to system manufacturers in trays or into retail stores in a box such as that shown here.

**__ Material Covered [Rubric] Mr-Brooks __** ** N **** procedure for a desktop computer teardown ** ** E **** resistors and colour codes ** ** E **** parallel circuits and series circuits [Formulas] ** ** E **** Capacitors ** ** N ** Flasher Circuits ** E **** Transistors ** ** N **** Breadboards ** ** N ** Integrated Circuits: Sand to ICs Communication Level 3 Stefan change your wiki name Graczyk S